EQS-Adhoc: BOOSTER Precision Components GmbH places subsequent bonds in an amount of EUR 18 million

Frankfurt a. M., 23 MAY 2024 – Today, Booster Precision Components GmbH (the “Company”) has following a bookbuilding process successfully placed a subsequent bond issue (the “Subsequent Bond Issue” or the “Subsequent Bonds”) in an amount of EUR 18 million under its existing senior secured floating rate bond loan 2022/2026 with ISIN NO0012713520 (the “Bonds”). Following the Subsequent Bond Issue, the outstanding amount under the Bonds will be EUR 49 million. The amount of the Subsequent Bond Issue has been successfully placed with institutional investors.

With reference to the press release issued on 13 May 2024, the Company has initiated a written procedure to request the bondholders to vote in favour of, amongst other things, the Company using the proceeds from the Subsequent Bond Issue to repay certain subordinated loans in an amount of EUR 15,000,000 which the Company is restricted from repaying pursuant to the terms and conditions for the Bonds (the "Written Procedure“). The notice of the Written Procedure is available on the Company's investor website (https://www.booster-precision.com/en/investor-relations/bond.html) and the last day for voting in the Written Procedure is 28 May 2024.

The Management Board
BOOSTER Precision Components GmbH

Contact:
BOOSTER Precision Components GmbH
Bockenheimer Landstraße 93
60325 Frankfurt a. M.
T +49 69 76758193
mail@booster-precision.com

1910093  23-May-2024 CET/CEST